Semiconductor processing euipment materials have to be thermally stable, capable of operationg in harsh environments and in many instances need to he actively cooled. S-Bond actiice solder are being widely adapted in sputtering targets, wafer handing, lithography equipment and in sensors and actuators. S-Bond solders can join aluminum and copper in thermal management devices and heat pipes. Our solders can also Si, SiC and other carbides and used in lithography, sensors and acuators.

Reducing bond contamination risks during brazing and soldering and eliminating the need for plating on metals typically used in metal to metal bonding and aluminum brazing. See how S-Bond Technology works.

Ceramic metal bonding for joints that are hermetic and thermally conductive. Can be used to solder ceramics and is used in carbon bonding, and sapphire bonding. Active soldering in many applications can replace ceramic brazing. More information on Ceramic Bonding >>

Aluminum bonding in one simple, flux free step and can replace aluminum brazing in many applications. Active solders eliminates the need to plate before soldering and aggressive chemical fluxes are not required thus post bond cleaning is not required.

Offering a range of vacuum brazing and bonding services, expanding our range of bonding services to our customers over and above our soldering services.

Protecting sensitive assembly components… joing a range of materials with active solderis with melting temperatures ranging from 115 – 450˚C. Bonding services are provided that take advantage of all the attributes of active soldering such as aluminum bonding and ceramic metal bonding. For more information on active solder processing >>

Brazing and soldering of dissimilar materials needs to accomodate differences in materials chemistry and thermal expansion properties of the materials being joined. Lower temperature metal bonding using S-Bond active solders, lowers thermal expansion mismatch stresses and the active elements in S-Bond solders permit these solders to wet and adhere to many base materials. For more information on dissimilar materials bonding >>