At the core of our S-Bond products and bonding services is our Active Solder Technology. S-Bond alloys are conventional solders that are made active when modified by the addition of key elements. These additions create a more chemically reactive solder that is able to bond with the surfaces of many materials, including surfaces coated with a layer of oxide or nitride. Depending upon the product, joining temperature, and substrate material, the bond can be based on a chemical reaction with the substrate, or result from a high level of atomic interaction between the S-Bond® product and the base material surface. Contact Us to discuss your particular materials and strength requirements.
To learn more about our S-Bond technology, please see:
Materials Joined by S-Bond Include:
|Copper||Silicon Carbide||Al-Silicon Carbide|
|Tungsten||Sapphire / Quartz||Carbon|
|Nickel||Tungsten Carbide||Graphite Foam|
|Gold||LTCC Materials||C-C Composite|
|Silver||Silicon Carbide-Diamond||Pyrolytic Graphite|
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