S-Bond Technology

At the core of our S-Bond products and bonding services is our Active Solder Technology.  S-Bond alloys are conventional solders that are made active when modified by the addition of key elements. These additions create a more chemically reactive solder that is able to bond with the surfaces of many materials, including surfaces coated with a layer of oxide or nitride. Depending upon the product, joining temperature, and substrate material, the bond can be based on a chemical reaction with the substrate, or result from a high level of atomic interaction between the S-Bond® product and the base material surface.  Contact Us to discuss your particular materials and strength requirements.

To learn more about our S-Bond technology, please see:

How S-Bond Works

S-Bond Joining Processes

S-Bond Joint Structures

Materials Joined by S-Bond Include:

Metals Ceramic MMC’s
Copper Silicon Carbide Al-Silicon Carbide
Aluminum Al-Nitride Al-Graphite
Silicon Titanium Carbide Nickel-TiC
Titanium Alumina Metal-Diamond
Tungsten Sapphire / Quartz Carbon
Kovar® Zirconia Graphite
Nickel Tungsten Carbide Graphite Foam
Gold LTCC Materials C-C Composite
Silver Silicon Carbide-Diamond Pyrolytic Graphite
Stainless Steel Diamond

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