SOLUTIONS & SERVICES
Solutions & Services
Improved Joint Strength and Sputtering Performance
S-Bond® active solders enable the dissimilar materials bonding and ceramic metal bonding to each other and to other metals, making an S-Bond solution very suitable for bonding sputter targets. S-Bond filler metal alloys produce reliable joints with copper, aluminum, steel, stainless steels, titanium, chromium, nickel alloys, refractory metal alloys and many ceramics including alumina, zirconia, AlN, and SiC. S-Bond alloys also join to most semiconductors including Si, GaAs, CIGS, and others. S-Bond 220 used in these applications offers much higher operating temperatures, up to 190°C, compared to indium soldering techniques which are only good to 130 C in service. S-Bond joints are nearly void free and offer excellent strengths and thermal contact.
- Directly, without the use of flux.
- Without pre-plating steps, eliminating multiple-step coating processes.
- At temperatures below 400ºC, preventing the distortion and softening of metals and also preventing ceramic fractures.
The joints produced by S-Bond active solders are:
- Strong (> 5,000 psi shear).
- Ductile, based on Sn-Ag or Sn-In alloys.
- Capable of service temperatures up to 190ºC.
S-Bond® active solder joining eliminates the need for flux and preplating while offering the capability to directly bond to ceramic and semiconductor materials. S-Bond® simplifies the joining of many of the typical sputter target geometries. The joining materials are Pb-free and their temperature capabilities exceed that of Indium. For example, S-Bond 220 and 220M joined sputter targets interfaces have shear strengths of 3 – 5,000 psi (20-32 MPa) and can be taken to 195ºC without significant lowering of the room temperature values.
S-Bond Materials for Sputter Target Joining
|S-Bond Alloy||Tm (ºC)||Tservice||Joint Strength(to copper, psi)|
|115 (In-Sn-Ag)||120||100||2 – 3,000|
Semiconductors / Compounds / Ceramics
|Silicon||Indium Zinc Gallium Oxide|
|Gallium Arsenide||Aluminum Oxide & Zirconium Oxides|
|Zinc Sulfide||Most other Metal Oxides|
|Silicon Dioxide||Titanium Carbide & Silicon Carbide|
|Indium Tin Oxide (ITO)||Copper Indium Gallium (Di)Selenide (CIGS)|
|Al – Zinc Oxide (AZO)||Cadmium Telluride|
Contact Us for a demonstration of S-Bond’s unique capability to meet many of your sputter target joining requirements. We also have an informative bulletin about S-Bond and Sputter Targets.
If you would like someone to contact you or provide information, please submit the information to the right.