High-Quality Bonding

S-Bond can effectively assemble a wide variety of materials or pieces with its unique bonding attributes:

  • Pb-free (meeting RoHS requirements)
  • Flux free
  • No metal pre-plating required
  • Joins dissimilar materials
  • Low temperature joining (limits base material changes or distortion)

S-Bond is being used to assemble a variety of manufactured components. This section reviews the components that S-Bond Technologies is currently manufacturing at its facility or is supporting at customers’ sites. Please preview the various components and applications. If you do not see yours, please Contact Us so we can discuss your specific bonding application.

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