Direct Die Attachment

Thermal Management

High performance microprocessors need new and innovative ideas for thermal management as they continue to increase in speed. One option is to improve TIM1 performance through the use of direct die attach using solder materials.

Conventional attachment techniques using filled polymers do not offer the same level of thermal conductivity as a completely metal bond.

Directly bonding to silicon and packaging materials typically requires the use of a flux or thin film metallization of the joining surfaces.

S-Bond Technologies offers options for bonding to silicon, metal, ceramic and ceramic composite materials without metallization or flux which, in many cases, can withstand lead free solder reflow cycles for board mounting. Contact Us for more information.

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