Bond Inspection

Bond Quality Assessment

For critical, functional components that need bond integrity, assessment methods to determine the completeness and quality of the bonded joint are required. Bonds can be measured non-destructively using x-rays, ultrasonic inspection, thermal imaging, leak checks, and for very small leaks, helium leak detection. A bonding process can also be destructively evaluated by sectioning, then mounting and polishing, followed by metallographic investigations (degree of looking at bonding, adherence or voiding) to assess the structure. Metallographic analyses can also assess metallurgical conditions at interfaces, looking at reactions and the degree of penetration of the elements from the joining filler metals.

S-Bond Technologies offers the following services:

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