Solder Joint Structures

S-Bond has the capability to join to a wide range of materials using various methods and achieves bonds through various mechanisms with varying degrees of bond interaction.This section illustrates typical joint microstructures obtained when using S-Bond Technologie’s solder products with a variety of materials.

S-Bond development staff are constantly evaluating bonds made to different materials, including carbides, piezoelectrics, silicon and other semiconductors as well as most metals and ceramics. If you do not see your materials listed in these sections, please Contact Us.

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