The ever increasing need for bandwidth and speed are driving the use of higher powered electronics in telecommunications in local broadcast vans, cell towers, central servers and satellites. High power electronics require unique and dedicated thermal management systems consisting of passive heat sinks, finned heat exchangers and actively-cooled cold plates. The materials of choice are often aluminum (Al), copper or a combination of the two, depending upon weight and cost considerations. Recently, more advanced materials have emerged as a substitute for Al and Cu such as graphite, aluminum and silicon carbide (Al:SiC) as weight reductions and increased thermal performance are needed. S-Bond alloys have been show to be effective in aluminum bonding, ceramic metal bonding and graphite bonding, hence the S-Bond technology has wide applicaion in this market area.
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