Ultrasonic Soldering

Ultrasonic soldering is a specialized soldering process that eliminates the need for chemical flux. In place of flux, it uses acoustic energy to disrupt oxides that form on molten solder and base metal surfaces during the joining process. Many times ultrasonic soldering is used to join difficult-to-wet materials like aluminum, titanium, glass, ceramics and dissimilar materials. Applications include electronics, medical decives, and structural components,  in various base metal combinations, such as copper, aluminum, and titanium, graphite, carbides and more.

Ultrasonic soldering is presented in three sections…

Ultrasonic soldering process features include:

  • Soldering without flux
  • No preplating or metallizations
  • Adherence of active solders to surfaces
  • Bonding to all metals, glass and ceramics

S-Bond Technologies offers materialsequipment and services for bonding a range of applications by soldering without flux. 

Contact us today for more information on the use of our active solders and ultrasonic soldering services for your applications. 

If you have interest and would like more information on ultrasonic soldering , use the More Information box on this page and indicate your interest.  

Find more information and continual updates on ultrasonic soldering in our Technology & Applications Whitepapers and our Blog.

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