Aluminum Foam Bonding - Graphite Foam Bonding - Carbon Foam Bonding

S-Bond® alloys are finding increasing applications in graphite foam bonding to metal. The limited capillarity and the active nature of S-Bond alloys enable them to join to porous surfaces without filling the pores. Graphite, metal and aluminum foams are emerging in high performance thermal management components for electronics due to their high specific surface area and lower weight. Other applications include the use of such foams for lightweight structures.

The figures to the left and right show examples of bonding graphite foam and metallic (aluminum) in thermal management applications.

Such joints’ microstructure can be seen in the pictures to the left. Note that S-Bond 220 has wetted both aluminum and graphite in these two examples and that the alloy is located at the interface and has encapsulated the foam without excessive penetration.

The major functional advantage of S-Bond alloys is that their metallic joints permit excellent heat transfer as can be seen in the figure below where graphite foams and aluminum foams were S-Bond joined to plate. The test consisted of heating the plates with a specified power density, then measuring temperatures in the water and the plates.

Note the superior heat transfer capacity of the S-Bond joined two configurations of Gr-Foam core compared to folded aluminum and brazed fin inside a cold plate where the S-Bond joined graphite provides a much lower thermal resistance (or higher cooling capacity).

The figure at the left illustrates another type of foam joint. The photomicrograph illustrates how stainless steel foams are bonded to copper. Such joining may be useful for making fluid or air filters.

Contact Us to discuss S-Bond’s solutions for aluminum foam bonding, graphite foam bonding, carbon foam bonding and other porous surfaces used in high performance thermal management components for electronics. See teg Technology & Applications White Papers section for additional information on bonding graohite and carbon.

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