APPLICATIONS
Semiconductor Processing Equipment
S-Bond active solder and associated processing can join many materials from aluminum and copper to silicon and a range of ceramics and carbides.
This can be applied to various types of semiconductor processing equipment, and many of these materials are used in…
- Thermal Management
- Optical Mirrors
- Sputtering Systems
- MEMS Sensors
- Gas Flow Control
For more information on how S-Bond active solders can be used in your semiconductor processing equipment, Contact Us.
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