S-BOND TECHNOLOGY
S-Bond Technology
At the core of our S-Bond products and bonding services is our Active Solder Technology. S-Bond alloys are conventional solders that are made active when modified by the addition of key elements. These additions create a more chemically reactive solder that is able to bond with the surfaces of many materials, including surfaces coated with a layer of oxide or nitride. Depending upon the product, joining temperature, and substrate material, the bond can be based on a chemical reaction with the substrate, or result from a high level of atomic interaction between the S-Bond® product and the base material surface. Contact Us to discuss your particular materials and strength requirements.
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Materials Joined by S-Bond Include:
| Metals | Ceramic | MMC’s |
|---|---|---|
| Copper | Silicon Carbide | Al-Silicon Carbide |
| Aluminum | Al-Nitride | Al-Graphite |
| Silicon | Titanium Carbide | Nickel-TiC |
| Titanium | Alumina | Metal-Diamond |
| Tungsten | Sapphire / Quartz | Carbon |
| Kovar® | Zirconia | Graphite |
| Nickel | Tungsten Carbide | Graphite Foam |
| Gold | LTCC Materials | C-C Composite |
| Silver | Silicon Carbide-Diamond | Pyrolytic Graphite |
| Stainless Steel | Diamond |
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