S-BOND TECHNOLOGY
Solder Joint Structures
Metal Composites Bonding
S-Bond® materials will bond to metal, ceramics and carbide composites individually or if they are mixed as part of a metal matrix composite (MMC’s). S-Bond® products have a unique ability to bond to the metal matrix and wet and adhere to the ceramic particles and/or fibers. Alternative processes involve precoating or treating the MMC surface followed by a flux based joining process.
The figure to the left shows how C:C has been bonded with S-Bond 220 to aluminum.
Al:SiC composites are leading candidates for low expansion bases for electronic substrate heat spreaders, replacing copper and aluminum. Al:SiC composites are also finding use in precision machine tools where low CTE and high stiffness are essential for positioning accuracy. Shown at left are S-Bond 220 joints between Al:SiC and Kovar® (a low CTE Ni-Fe-Co alloy).
To the left one can see that another type of Al-composite that has been joined. It is an Al:Gr fiber – metal matrix composite joined with S-Bond 220 resulting in a dense structure with good adherence.
Contact Us to discuss S-Bond’s active solder solutions for metal composites bonding, mmc bonding, and all combinations of metal bonding.
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