Cold Plate Solutions

Actively cooled cold plates utilize copper or aluminum tubes. They are typically bonded into aluminum plates to reduce weight and optimize thermal conductivity thus minimizing hot spots on the electronics that may be mounted onto the plates. Alternatively, cold plates may have machined passages that need to be covered and sealed to contain the cooling fluid. S-Bond joining is an effective cold plate solution for joining Al-Al, Cu-Cu and Al-Cu cold plates in any combination of materials or design.

S-Bond joining is fluxless, therefore the incompatibly of copper and aluminum fluxes is not a problem and the entrapment of flux in channels does not occur. This eliminates the need for post-joining cleaning and the potential corrosion from residually entrapped flux.