SOLUTIONS & SERVICES
Solutions & Services
Sputter Targets
Improved Joint Strength and Sputtering Performance
S-Bond® active solders enable the dissimilar materials bonding and ceramic metal bonding to each other and to other metals, making an S-Bond solution very suitable for bonding sputter targets. S-Bond filler metal alloys produce reliable joints with copper, aluminum, steel, stainless steels, titanium, chromium, nickel alloys, refractory metal alloys and many ceramics including alumina, zirconia, AlN, and SiC. S-Bond alloys also join to most semiconductors including Si, GaAs, CIGS, and others. S-Bond 220 used in these applications offers much higher operating temperatures, up to 190°C, compared to indium soldering techniques which are only good to 130 C in service. S-Bond joints are nearly void free and offer excellent strengths and thermal contact.
- Directly, without the use of flux.
- Without pre-plating steps, eliminating multiple-step coating processes.
- At temperatures below 400ºC, preventing the distortion and softening of metals and also preventing ceramic fractures.
The joints produced by S-Bond active solders are:
- Strong (> 5,000 psi shear).
- Ductile, based on Sn-Ag or Sn-In alloys.
- Capable of service temperatures up to 190ºC.
S-Bond® active solder joining eliminates the need for flux and preplating while offering the capability to directly bond to ceramic and semiconductor materials. S-Bond® simplifies the joining of many of the typical sputter target geometries. The joining materials are Pb-free and their temperature capabilities exceed that of Indium. For example, S-Bond 220 and 220M joined sputter targets interfaces have shear strengths of 3 – 5,000 psi (20-32 MPa) and can be taken to 195ºC without significant lowering of the room temperature values.
S-Bond Materials for Sputter Target Joining
| S-Bond Alloy | Tm (ºC) | Tservice | Joint Strength(to copper, psi) |
|---|---|---|---|
| 115 (In-Sn-Ag) | 120 | 100 | 2 – 3,000 |
| 130 (In-Sn-Ag) | 135 | 120 | 2-3,000 |
| 140 (Sn-Bi-Ag) | 150 | 135 | 3-4,000 |
| 220 (Sn-Ag) | 235 | 195 | 5-6,000 |
| 220M (Sn-Ag) | 235 | 195 | 5-6,000 |
Metals
| Gold | Copper |
| Silver | Tantalum |
| Nickel | Cobalt |
| Vanadium | Iron |
| Antimony | Chromium |
| Tellurium | Manganese |
| Germanium | Stainless Steel |
| Aluminum | Molybdenum |
| Titanium | Tungsten |
Semiconductors / Compounds / Ceramics
| Silicon | Indium Zinc Gallium Oxide |
| Gallium Arsenide | Aluminum Oxide & Zirconium Oxides |
| Zinc Sulfide | Most other Metal Oxides |
| Silicon Dioxide | Titanium Carbide & Silicon Carbide |
| Indium Tin Oxide (ITO) | Copper Indium Gallium (Di)Selenide (CIGS) |
| Al – Zinc Oxide (AZO) | Cadmium Telluride |
Contact Us for a demonstration of S-Bond’s unique capability to meet many of your sputter target joining requirements. We also have an informative bulletin about S-Bond and Sputter Targets.
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