Ultrasonic Soldering & Active Solders

S-Bond® active solders are very effective in combination with ultrasonic soldering for a range of applications. Ultrasonic soldering (U/S) is a fluxless soldering process and is finding growing application in soldering of metals and ceramics from solar photovoltaics and medical shape memory alloys to specialized electronic and senor packages. U/S soldering has been reported since 1955 as a method to solder aluminum and other metals without the use of flux. The reason for expanding usage is that ultrasonic soldering is a fluxless process. (more…)