Aluminum Bonding with Active Solders

Active solder, S-Bond® alloys have been developed to bond to a range of metals, ceramics and composite materials without the need for fluxes of preplating. In particular, such active solder alloys have an affinity for joining aluminum to itself and other metals and ceramics. Aluminum soldering has gotten simpler with the emergence of such S-Bond® solders. Just melt the S-Bond filler metals, mechanically spread them on the surface via brushing, rubbing, or via ultrasonically activated spreaders and the alloys will wet, adhere and provide a base for bonding. In a subsequent step, when two molten pre-tinned S-Bond layers are pressed or slid together the S-Bond layers will activate a strong solder bond. (more…)