Automotive enthusiasts and new car buyers are used to seeing reviewers talk about ceramic brakes in high-performance sports cars. Due to their thermal properties, these brakes provide improved performance. However, they aren’t just in high-performance cars anymore. A new industry review indicates that ceramic pads now represent about 60 percent of the market.
Improvements in soldering will be important in the development of performance brake pads. Molded metal shims help minimize wobble and improve clamping ability by keeping more of the pad in contact with the rest of the assembly. However, less expensive pads may only include tape to attach these, so people who expect quality may look to see integrated shims, a design goal which can be accomplished with aluminum soldering. (more…)
S-Bond Technologies has developed S-Bond® 140, a new, lower temperature active solder that melts from 135 – 140°C. This new alloy is formulated with a Bismuth-Tin (Bi-Sn) eutectic base composition, which is then alloyed with active elements and rare earths. The resulting S-Bond® 140 active solder successfully bonds a wide range of materials without the requirements of flux or pre-plating.
Lower bonding temperatures enable multi-step soldering operations, mitigating the risk of remelt where previously soldered connections or seals must remain intact. Active solders that melt below 150°C are also finding use in thermally sensitive applications, replacing Sn-Ag based solders that melt over 215°C and cause thermal degradation of the component parts being assembled. Lower temperature soldering also provides processing advantages when bonding dissimilar materials where thermal expansion mismatch many times fractures or distorts an assembly’s component parts.
Dr. Smith, President of S-Bond Technologies, states that “S-Bond 140 is already finding application in glass-metal seals in electronic packages in the avionics industry, where higher temperature soldering alloys would have damaged the packages’ components. We are also using S-Bond 140 to bond LED packages to heat pipes and vapor chambers to protect the thermally sensitive phase change fluids from damaging the devices when solder bonding. We see major market potential for this active solder composition. It is an economical bonding solution, since it does not rely on expensive Indium in its base.”