We are pleased to introduce our Blog as part of our commitment to communicate effectively with our customers, our prospective customers and anyone interested in our S-Bond, active solder bonding technology. This blog will feature news, technical updates, application updates, and general discussions about bonding and assembly of components.
We look forward to you visting our website and participating in the blog. As the blog develops interest, we hope to have good discussions about the active solder joining and related bonding technology and applications. Feel free to comment in our blog space.