In a little more than one month, leading minds from a wide range of industries will come together for the annual NVIDIA GPU Technology Conference. The goal of the three-day event running from March 18 to March 21 in San Jose, California, is to discuss how GPU computing technologies can fuel innovation in design and manufacturing processes.
Everything from mobile computing to cloud solutions and the growing power of supercomputers will be on the table. Specific focuses will include improving efficiency throughout each leg of the product development life cycle and using photo-realistic renderings to minimize the need for building numerous physical prototypes.
However, there are several other innovative technologies without which such a conference would not exist. State-of-the-art thermal management of electronics techniques and active solder solutions are essential before any of the previously mentioned systems can be put to use. They allow products in all of these industries to be built and maintained in the first place.
Computers powerful enough to handle the high-quality, real-time visual simulations manufacturers would need to reduce their reliance on physical prototypes will generate significant amounts of heat – as will mobile devices tasked with increasingly complex functions. Thermal management technologies are the building blocks on which the innovations of countless industries stand.
Last week, Italy’s “Eurora” supercomputer set a record for data center energy efficiency, according to an NVIDIA GPU release.
“Advanced computer simulations that enable scientists to discover new phenomena and test hypotheses require massive amounts of performance, which can consume a lot of power,” said Sanzio Bassini, director of HPC Department at the Cineca facility in Bologna, Italy.
With more power typically comes more heat. For that reason, thermal management will always be critical in any sector reliant on electronics.