Hybrid S-Bond joining processes eliminate the use of fluxes and have been shown to be more effective since it completely joins with the S-Bond filler metals. The methods that are recommended to minimize the use of S-Bond, yet still achieve fluxless joining are as follows: (more…)
S-Bond 220 is a solder material (Sn-Ti-Ag) and a process by which most materials, including dissimilar metallic and ceramic materials can be joined. It is a new family of solders, developed and patented by S-Bond Technologies. The material is an activated solder with elements added to the alloy that react with surfaces during joining and adhere to any surface films that normally disrupt wetting and bonding. The characteristics of S-Bond 220 include: (more…)
S-Bond Technologies and EWI have signed an agreement granting S-Bond Technologies the ability to distribute EWI’s patented lead-free, fluxless solder marketed by EWI as EWI SonicSolder®. The agreement is effective immediately. SonicSolder® is an active solder that permits the cost effective fluxless joining of aluminum, copper, other metals, glass, and ceramics without the need for plating. (more…)
