CES 2013 features new, more powerful processors and other technologies

Every year at the Consumer Electronics Show (CES), companies unveil the latest and greatest products and technologies they hope will catch on like wildfire in the consumer and business markets.

With such a dramatic shift toward mobile computing in the last few years, manufacturers are looking to usher in game-changing innovations that average individuals and business professionals alike will flock to stores to purchase.

But, with every improvement made to the processing power of tablet computers, smartphones, laptops and other devices, they must be matched by thermal management technologies that prevent overheating and allow them to handle the tasks they were designed for.

At this year's CES, currently taking place in Las Vegas, Nevada, chipmaker Nvidia officially announced its Tegra 4 mobile processor. This latest offering boasts 72 GPU cores and six times the graphics processing power of its predecessor, the Tegra 3. Additionally, combined with a new quad-core ARM Cortex-A15, users will see a 2.6x boost to Web browsing speeds and mobile application performance.

"Tegra 4 provides enormous processing power and efficiency to power smartphones and tablets, gaming devices, auto systems and PCs," Phil Carmack, senior vice president of the Tegra business at Nvidia, said in a release. "Its new capabilities, particularly in the area of computational photography, will help improve a whole range of existing products and lead to the creation of exciting new ones."

Nvidia has just provided one of the many electronics innovations that will be featured throughout CES 2013. And with each of these new designs, there will come a renewed focus on thermal management of electronics so that companies can design tablets and smartphones equipped to take full advantage of such breakthroughs.

Manufacturers are trying to pack in as much power as possible inside lighter, thinner, more portable products. That means more powerful processors in more confined spaces. As a result, leading ways of joining dissimilar metals and thermal management technologies must be strategically used in concert with one another.

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