As the smart phone market becomes increasingly crowded and competitive, manufacturers are constantly jockeying for the edge in their phone's specs that will push their newest model to the forefront of the market. The biggest showdown in the industry today has emerged between the increasingly popular Samsung Galaxy line and Apple's iPhone. The rivalry between the two companies, though, has focused heavily on screen size rather than the device's features in recent months, with Apple struggling to keep up with its competitors.
Later this month, Samsung is expected to release the Galaxy S4, which will reportedly feature a 4.99-inch screen. Meanwhile, Apple has made attempts to avoid falling behind its competitors with a 4.8-inch screen on its own phone. However, manufacturers have struggled to incorporate the larger screen into iPhone.
Cases such as these are evidence that, even though a company has a design for the newest, groundbreaking phone in mind, the actual production of the device is not so simple. Manufacturers must always consider realities of creating safe and functional hardware, such as dealing with thermal management technologies, while still retaining optimal processing power and features.
This puts an extraordinary amount of pressure on companies, which are expected to make frequent upgrades to their existing products, with lofty standards placed on the features of each new phone. However, with each new development, there must be corresponding modifications to the device that allow it to handle the increased power. For example, the development of larger screens and more powerful processors is just as important as creating heat sinks that can withstand the increased stress placed upon the device.
While cell phone manufacturers are tasked with the implementation of new features in their new phones, it falls to companies such as S-Bond to develop thermal management solutions that allow such powerful devices to function in such a small package.